v 0.17.0
Wire bonder
Red - Inactive, visible but non-bookable
General description
Wire bonder equipped with 25 um diameter Al wire for electrical contacting of semiconductor devices. Operation parameters are optimized for use with III-V semiconductor devices
Availability
Instrument is clean room based and only available after mandatory clean room safety and equipment training.
Incidentally samples can be bonded on request.
Basic information
Category Device processing
Short name Wire bonder
Full name Marpet Enterprises wire bonder
Location HG03.540